Technical Programme Committee

Technical Program Committee Chairs

Claudio Paoloni
Lancaster University, UK

Bo Zhang
University of Electronic Science and Technology of China, China

Track Chairs

Track A – Metamaterials

Giorgio Salvini
University College London, UK
Shuang Zhang
University of Hong Kong, HK
Track B – Vacuum electronics

Adrian Cross
Strathclyde University, UK
Jinjun Feng
Beijing Vacuum Electronics Research Institute (BVERI), China.
Track C – Solid state technology

Viktor Krozer
Goethe University Frankfurt, Germany
Yong Fan
University of Electronic Science and Technology of China, China
Track D – Astronomy, Earth observation and Satellite applications

Peter Hargrave 
Cardiff University, UK
Richard Wylde
Terahertz, UK
Track E – Wireless Communications

Angeliki Alexiou
University of Piraeus, Greece
Kai-Kit Wong
University College London
Track F – Antennas

Akram Alomainy
Queen Mary University of London, UK. 
Xiu Yin Zhang
South China University of Technology, Guangzhou, China
Track G – Advanced manufacturing  technologies and measurements 

Xiaobang Shang 
NPL, UK.  
Xuyuan Chen
Vestfold University, Norway
Track H – Applications

Hui Wang
STFC, UK
Track I – Imaging

Emma MacPherson
University of Warwick, UK
Deng Bin
National University of Defense Technology, China.
TPC Members
Chong Han

Shanghai Jiao Tong University, China
John Jelonnek

KIT, Germany

Ernesto Limiti

University Tor Vergata, Italy

Peter Huggard

Rutherford Appleton Laboratory Space, UK
Nuno Borges Carvalho

University of Aveiro, Portugal

Tobias Rommel

DLR, Germany

Yue Gao

University of Surrey, UK

Richie Leo

ZTE Corporation, China

Kin-Fai (Kenneth) Tong

University College London, UK

Carolina Tienda-Herrero

Airbus, Uk

Wang Hongqiang

National University of Defense Technology, China.

Nikita Ryskin

Institute of Radio Engineering and Electronics, Russia

Yi Wang

Birmingham University, UK

Bin Yang

University of Chester, UK 

Nick Ridler

NPL, UK

Mike Geen

Filtronic Plc., UK

Edward Wasige

Glasgow University, UK 

Maziar Nekovee

University of Sussex, UK

Guillaume Ducournao

University of Lille, France

Greg Gibbons

University of Warwick, UK

 Yi Huang

University of Liverpool, UK

Nuno Borges Carvalho

University of Aveiro, Portugal

Jiafeng Zhou

University of Liverpool, UK

Jia-Sheng Hong

Heriot-Watt University, UK

Qi Luo

University of Hertfordshire, UK

Valerio Frascolla

Intel, Germany

Zhi Chen

University of Electronic Science and Technology of China, China

Yujian Li

Beijing Jiaotong University, China

Richie Leo

ZTE, China

Haiwen Liu

Xi’an Jiaotong University, China

Xue-Xia Yang

Shanghai University, China

Weicong Na

Beijing University of Technology, China

Jianjun Ma

Beijing Institute of Technology, China

Keping Wang

Tianjin University, China

Zhengpeng Wang

Beihang University, China

Yang Hao

Queen Mary University of London, UK. 

Qiang Cheng

Southeast University, China

Zhang-Cheng Hao

Southeast University, China

Yi-Jun Feng

Nanjing University, China

Yujian Cheng

University of Electronic Science and Technology of China, China

Ming-Chun Tang

Chongqing University, China

Biao Du

CETC-54, China

Dawei Zhou

Honor Ltd, China

Xiaohe Cheng

Beijing University of Posts and Telecommunications, China

Rupa Basu

Lancaster University

Sanming Hu 

Southeast University, China

Xiao-Ming Chen

Xi’an Jiaotong University, China

Hungyen Lin

Lancaster University

Kaixue Ma

Tianjing University, China

Wei Hong

Southeast University, China

Yu Luo

Tianjing University, China

Bin Li

Beijing Institute of Technology, China

Changrong Liu

Soochow University, China

Dazhi Ding

Nanjing University of Science and Technology, China

Feng Feng

Tianjin University, China

Guoqing Luo,

Hangzhou Dianzi University, China

Shen Yaochun

The University of Liverpool, China

Qingfeng Zhang

Southern University of Science and Technology, China

Wenmei Zhang

Shanxi University, China

Chaohai Du

Peking University, China

Luigi Boccia

University of Calabria, Italy

Fanyi Meng

Tianjin University, China